SISCCON 2026 – 1st International Conference on Smart Innovation and Soft Computing 7TH TO 9TH February 2026, Raipur, India (Hybrid Mode)

 SISCCON 2026 – 1st International Conference on Smart Innovation and Soft Computing

7TH TO 9TH February 2026, Raipur, India (Hybrid Mode) 

https://sisccon2026.com  

 

If you are interested in serving as a Session Chair, please fill out the form at https://www.sisccon2026.com/author.
A Session Chair may chair one or two sessions. Additionally, if you are able to manage six paper submissions from your network, you will be entitled to present one paper free of cost.

 

 

 

We are pleased to invite you to submit original and previously unpublished research papers (not currently under review elsewhere) for presentation at the conference. Submissions should be limited to a maximum of five pages, formatted in Bentham Science Conference Proceedings double-column style ( https://www.eurekaselect.com/ ), including all figures and references. The standard submission covers the first five pages; any additional pages will incur a fee of ₹1,000 or USD 10 per page. All accepted papers, with at least one author registered at the full conference fee, must be presented at the event to be considered for inclusion in the official proceedings.

Peer-reviewed and selected papers will be published in the Bentham Science Conference Proceedings, which are indexed in Scopus and Web of Science (WoS).

 

Important Dates:

Paper Submission Opens:                        31th  July 2025

Paper Submission: Deadline:    10th November 2025

Notification of Acceptance:     15th November 2025

Camera-Ready Submission:       25th November 2025

Early Bird Registration Opens:   15th  November 2025

Registration Deadline:        6th  January 2026

Conference Dates:           7–8th & 9th  Feb 2026

 

Venue and Mode

SISCCON 2026 will be hosted at Hotel Babylon Inn, Raipur, India, in a dedicated conference hall accommodating up to 250 participants, with full support for hybrid participation to ensure global accessibility.

Topics of Interest

We welcome submissions on, but not limited to, the following areas:

· Soft Computing and Intelligent Systems

· Artificial Intelligence, Machine Learning, and Cloud Computing

· Cybersecurity and Industrial Internet of Things (IIoT)

· Robotics and Automation

· Augmented Reality and Virtual Reality Technologies

· Smart Manufacturing and Industry Applications

· Healthcare, Agriculture, Smart Cities, and Allied Domains

· Smart Grid

· Embedded System

* Electric Vehicle

Note: Full-fee registration (Students, Researcher, Academician, Industry, or Foreign Author) is mandatory for paper inclusion in the proceedings.

Submission Guidelines

· Papers must be 5–8 pages in length, with additional charges for pages exceeding five.

· Submissions must be original, not under review elsewhere, and formatted in Bentham Science Conference Proceedings double-column style.

· At least one author per accepted paper must register at the full fee for inclusion in the proceedings and presentation.

· Submit through the following link:  https://cmt3.research.microsoft.com/SISCCON2026 

Or Call for paper(paper format):  https://www.sisccon2026.com/author 

Submission Process and Inquiries : https://sisccon2026.com 

Please submit your manuscript via the submission portal on the SISCCON 2026 website. For inquiries, contact contact@sisccon2026.com or editor@sisccon2026.com.

We warmly encourage you to share this announcement with your colleagues and invite their contributions to this vibrant platform for advancing smart innovation and soft computing.

Sincerely,
Organizing Committee
SISCCON 2026

https://sisccon2026.com  

--

The primary objective of this international conference is to unite researchers from prestigious institutions worldwide. The invitation extends to professionals and executives in the fields of soft computing, AR/VR, Cloud Computing, AI/ML, cyber security, robotics, industrial Internet of things, and manufacturing industries. The focus of SISCCON is to foster the exchange of ideas and information, emphasizing innovative techniques that address contemporary challenges in technology.